Measurement of local strength distribution of directly bonded silicon wafers using the micro-chevron-test

Bagdahn, J., Plößl, A., Wiemer, M. and Petzold, M.

Proceedings of the 5th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 218-223 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)



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