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Interfaces and Material Systems
MD-Simulations Wafer Bonding
Abstract
People
Publications
Cooperations
Alumni
2006
Scheerschmidt, K.
Empirical molecular dynamics: Possibilities, requirements and limitations
.
In:
Theory of Defects in Semiconductors
104
, Ed. D. A. Drabold , S. K. Estreicher p 213-244 Springer, Heidelberg, Germany (2006)
2004
Scheerschmidt, K. , and V. Kuhlmann
Molecular dynamics investigation of bonded twist boundaries
.
Interface Science
12
(2/3) , p 157-163 (2004)
2003
Scheerschmidt, K. , and V. Kuhlmann
Nanostructures simulated by molecular dynamics for TEM analysis
.
Microscopy and Microanalysis
9
, p 232-233 (2003)
2002
Scheerschmidt, K. , D. Conrad , and A. Y. Belov
Atomic processes at bonded Si-interfaces studied by molecular dynamics: Tayloring densities and bandgaps?
.
Computational Materials Science
24
, p 33-41 (2002)
2001
Koitzsch, C. , D. Conrad , K. Scheerschmidt , F. Scharmann , P. Maslarski , and J. Petzold
Carbon-induced reconstructions on Si(111) investigated by RHEED and molecular dynamics
.
Applied Surface Science
179
, p 50-55 (2001)
Scheerschmidt, K. , D. Conrad , and Y.-Ch. Wang
Tight-binding-based potentials: Molecular dynamics of wafer bonding
.
Computational Materials Science
22
, p 56-61 (2001)
2000
Wang, Y.-Ch. , K. Scheerschmidt , and U. Gösele
Theoretical investigations of bond properties in graphite and graphitic silicon.
.
Physical Review B
61
, p 12864-12870 (2000)
1999
Belov, A. Y. , R. Scholz , and K. Scheerschmidt
Dissociation of screw dislocations in (001) low-angle twist boundaries: a source of the 30 degrees partial dislocations in silicon
.
Philosophical Magazine Letters
79
(8) , p 531-538 (1999)
1998
Belov, A. Y. , D. Conrad , K. Scheerschmidt , and U. Gösele
Atomic study of the (001) 90
o
twist grain boundary in silicon
.
Philosophical Magazine A
77
, p 55-65 (1998)
Scheerschmidt, K. , D. Conrad , A. Y. Belov , and H. Stenzel
UHV-silicon wafer bonding at room temperature: Molecular dynamics and experiments
.
Electrochemical Society Proceedings
97-36
, p 381-392 (1998)
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