Effect of O2 plasma pretreatment on the bonding behavior of silicon (100) wafers.

Wiegand, M., Kräuter, G. and Reiche, M.

Proceedings of the 5th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 282-291 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)