Bonding behavior of different interfacial layers.

Reiche, M., Wiegand, M., Stolze, D. and Schwarz, U.

Proceedings of the 5th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 100-109 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)