PLasma activation for low-temperature wafer direct bonding.

Reiche, M., Wiegand, M. and Dragoi, V.

Proceedings of the 5th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 292-301 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)