Recent developments in adhesion-enhanced high-vacuum bonding by in situ plasma surface precleaning.

Kopperschmidt, P., Luan, H.-C. and Kimerling, L. C.

Proceedings of the 5th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 259-264 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)