Publication $pid

Low temperature Si-Si and GaAs-Si direct wafer bonding using spin-on glass intermediate layer

Dragoi, V., Alexe, M., Reiche, M. and Gösele, U.

Proceedings of the 5^th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 80-84 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)