Wafer contamination protection by direct wafer bonding and air jet debonding.

Alexe, M. and Gösele, U.

Proceedings of the 5th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 99-35, pp 195-199 (Eds.) Hunt, C. E., Abe, T., Baumgart, H. and Gösele, U., The Electrochemical Society, (1999)