Major Research Collaborations

TESIN

Abstract People Publications Projects Alumni

The fabrication of sSOI wafers, their characterization and application to advanced integrated devices are the objectives of the project “Tetragonally strained silicon for nanoelectronics” (TESIN). The project starts in May 2004 for a period of 3 years. An extension for an additional year (up to April 2008) is realized by TESIN+.

The project combines research activities of

• AMD Saxony LLC & Co. KG, Dresden
• Siltronic AG, Burghausen
• Aixtron AG, Aachen
• Infineon Technologies AG, Munich

    (since 2006 Quimonda AG, Dresden

• Max Planck Institute of Microstructure Physics, Halle
• Research Center, Juelich
• IMEC, Leuven

All project partners are also partners within the

MEDEA+ project 2T 101 “Strained silicon on insulator substrates for high performance ICs” (SILONIS)