Interfaces and Material Systems

MD-Simulations Wafer Bonding

AbstractPeoplePublicationsCooperations
Alumni
Alumni


Detlef Conrad
SYNOPSYS

Alexander Belov
Werkstoffwiss.,TU-DD

Yu Chen Wang

Hiroshi Yamaguchi
RCAST-Tokyo

Heinz Stenzel

 

Dirk Timpel

Hochschule Karlsruhe – Technik und Wirtschaft

University of Applied Sciences


back  |  print  |  to top