Interfaces and Material Systems

Implantation, Wafer Bonding & Layer Transfer

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Singh, R. , I. Radu , R. Scholz , C. Himcinschi , U. Gösele , and S. H. Christiansen
Investigation of helium implantation induced blistering in InP.
Journal of Luminescence 121 (2) , p 379-382 (2006)

Radu, I. , R. Singh , R. Scholz , U. Gösele , and S. H. Christiansen
Formation of nanovoids in high-dose hydrogen implanted GaN.
Applied Physics Letters 89 (3) , p 031912 (2006)

Singh, R. , I. Radu , R. Scholz , C. Himcinschi , U. Gösele , and S. H. Christiansen
Low temperature InP layer transfer onto Si by helium implantation and direct wafer bonding.
Semiconductor Science and Technology 21 (9) , p 1311-1314 (2006)

Singh, R. , I. Radu , U. Gösele , and S. H. Christiansen
Investigation of hydrogen implantation induced blistering in GaN.
Physica Status Solidi C 3 (6) , p 1754-1757 (2006)

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